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88E11 3N20D 101MM B2003RU DTA144E SL1613 CSNE33 TPS56300
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  n i chia st s-da1- 2472a nichia corporation specifications for full color led NSSM124T pb-f r e e r e f l o w so lder ing a ppli c at io n r o hs co mp lia nt r g b sorted (rgb d i e lit separ a tel y .) http://
n i chia st s-da1- 2472a 1 specifica t ions (1) ab sol u te maxi mum r a ti ngs absolute maximum rating item symbol blue green red unit forward current i f 25 35 50 ma pulse forward current i fp 80 110 150 ma reverse voltage v r 5 v power dissipation p d 88.7 124 127 mw total power dissipation p tot 150 mw operating temperature t opr -30~85 c storage temperature t stg -40~100 c junction temperature t j 100 100 100 c * abs o l u te maxi mum r a t i ngs at t a =25c. * i fp co ndit io n s wi th pu ls e wi dth 1 0 m s an d dut y cycl e 10%. * the absolute max i mum p o wer di ssi p a t i o n per die. * the abso l u t e max i m u m p o wer d i s s ipa t io n in to ta l per p a ck age . ( 2 ) in it ial e l ect r ical/ o pt i cal c h ar acterist ics ty p item symbol condition blu e green red unit fo rw ard v o ltag e v f b i f =20m a g i f =20m a r i f =20m a 3.2 3. 2 2.2 v re v e rse current i r b v r =5v g v r =5v r v r =5v - - - a lum i no us in te nsit y i v b i f =20m a g i f =20m a r i f =20m a 450 2100 750 m c d x 0. 133 0. 189 0. 700 chromaticity c oordinate y - b i f =20m a g i f =20m a r i f =20m a 0. 075 0. 718 0. 299 - * char acteristics at t a =25c . * lum i nous int e nsit y v a lue as pe r cie 127: 2007 s t andar d . * chrom a t i ci t y coordi nate s as pe r cie 1931 chrom a ti cit y chart .
n i chia st s-da1- 2472a 2 ranks blue green red item min max min max min max unit f o rw ard v o l t ag e 2. 80 3. 55 2. 75 3. 55 1. 80 2. 55 v r e v e rse current - 50 - 50 - 50 a lumi no us int e ns it y 300 600 1400 2800 500 1000 mcd color r a nk blu e rank w x 0. 139 0. 129 0. 113 0. 134 0. 145 0. 152 y 0. 035 0. 050 0. 080 0. 105 0. 072 0. 056 green rank g0d x 0. 136 0. 190 0. 219 0. 250 0. 220 0. 176 y 0. 739 0. 628 0. 637 0. 638 0. 745 0. 750 re d rank r x 0. 674 0. 648 0.677 0.708 y 0. 296 0. 323 0.323 0.292 * r a nking at t a =25c. * t o ler a nce of mea s ure m e n t s of the f o rward v o ltage is 0 .0 5 v . * t o ler a nce of mea s ure m e n t s of the l u m i n o us in ten s it y is 10%. * t o ler a nce of mea s ure m e n t s of the c h romaticit y coordinate is 0.01.
n i chia st s-da1- 2472a 3 chroma ticity d i agram 550 56 0 570 51 0 50 0 49 0 460 47 0 480 60 0 59 0 58 0 610 62 0 63 0 54 0 53 0 520 w g0 d r 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 0.0 0 .1 0.2 0 .3 0.4 0 .5 0.6 0 .7 0.8 x y
n i chia st s-da1- 2472a 4 outline dimensions sts- da7- 0041b nssm124 no. ( g unit: mm) t h is produc t co m p li es wi th ro hs d i re cti v e. u ? ro hs ? m ?? * ( g un it : mm, to le r a n c e : 0. 2) t h e red, bl ue a n d g r een di e are c o n n ec ted to the ca thode s i de. red bl u e green ` g ? ? * g r een 25 bl ue 34 red 1 6 ? item ??`| package materials ??| encapsulating resin materials ?O| electrodes materials | weight description ????` heat-resistant polymer ?? ?? epoxy resin (with diffuser) ~? + y? ag-plated copper alloy 0.014g (typ) 0.75 0.1 0.1 (0.7) (0.7) (2.55) 3.3 (2.25) red 4 6 5 3 2 1 g r een bl ue 3 2.8 pin-1 mark 0.5 (0.34) 0.5 0.5 2.1
n ichia st s-da1- 2472a 5 soldering ? r e co mm end e d r e f l ow sold ering co ndi t io n ( lead -free sol d er) ? r e co mm end e d hand so lde r ing cond it ion temperature 350c max soldering time 3sec max r e co mmen d e d sold ering p ad p a ttern ( g unit: mm) 2.2 0.85 0.75 0.85 3.05 4.5 1.15 1.15 * thi s led is desi gned to be refl ow so l d ered on to a pc b . if dip soldered , n i ch ia can n ot guar antee its r e liabilit y . * r e flow so ld ering mu st not be performed more than twic e. han d sold ering mu st not b e performed more than o n ce. * a v oid r apid cooling. r a mp down th e temp er ature gr adua lly from th e peak temper ature. * n i trogen ref l ow soldering is re co mmend e d. air flow sold ering cond it ion s can cause op tical d e gr adation, caused by h e at and / or atmospher e . * r e pairing should not be d one after th e l e ds ha v e been solder ed. wh en repair i ng is u n a v oidable, a double-h ead solder ing ir on shou ld be u s ed. it should b e confir med b e forehand wh et h e r th e char ac te ri st i cs of th e l e d s wi ll or w i l l not be damaged by repairing . * when sold ering, do not ap ply stre s s to t h e le d whi l e th e le d is hot . * this produ c t can d i ffer i n opti cal char ac t e ris t i cs d e pe nd ing on the nu mber of reflow cycl es . in a single disp la y , on ly l e ds with sa me numb e r of reflow cy cles shou ld be u s ed reg a rdless of th e application t y p e , such as ren t al a n d/or per m an ent in sta llation s. 120sec max pre- hea t 180 t o 200c 260c max 10sec max 60sec max above 220c 1 t o 5c per sec
n ichia st s-da1- 2472a 6 t a pe and reel dimensions sts- da7- 0042 quant i t y per r e el = 3500 p c s 1 `? 3500 ? * nxxx124x 1. 05 0. 1 ` ??? tap e 4 0.1 1.75 0.1 4 0.1 2 0.05 3.5 0.05 -0 1. 5 +0 .1 8 +0.3 -0.1 ?` / ` trailer and leader to p co ver ta p e led ?? ` min 400mm ? ` min 160mm ? tr a i ler 160 mm min ( e m p t y pocket s) lo aded po ckets ? ? ` e m bo ss ed c a rr i e r t a pe ?? ` ?` f eed dir e ct ion leader w i t h out top co ver tape 400 mm min min 100mm lea d er with to p cov e r ta p e 100 mm min (em p t y pocket ) `? reel f 1 3 0 . 2 f 2 1 0 . 8 ? l abel 2 1 0 . 8 1 3 0 . 2 11.4 1 9 0 .3 60 +1 -0 180 +0 -3 th e t ape packin g met h o d c o mp lies w i t h j i s c 0806 (p ack aging of ele c troni c co mpo n e n ts o n co nt i nuous t apes ) . * j i s c 0806 ?? ?` ?? ? no . ( g unit: mm) 0.2 0.05 3.5 0.1 3.1 0.1 pin-1 mark -0 1 +0.2
n i chia st s-da1- 2472a 7 p a ckaging - t a pe & reel nichia led sts-da7-0006b n x xxxxxx ? label la b e l no . reel ` ?` sea l mo isture-proo f bag ? ? for details, see "lot numbering scheme" in this document. * ? ? ???? ? ? if n o t provide d , it is n o t in d i cat e d on t h e l a b e l . ******* is t h e cus t o m er p a r t n u mber. O ? ? ? ? * ******* ? the l a b e l does no t have the r a n k fi el d fo r u n - ra n k e d pr o d u c ts. * ? ? ? ? rohs nxxx xx xx xxxx led ******* nichia corporation 491 oka, kaminaka, anan, tokushima, japan typ e lot qty . ym xx xx -rrr pcs rohs nxx xxx xx xxxx led ** *** ** rr r pcs typ e rank qty. nichia corporation 491 oka, kaminaka, anan, tokushima, japan reels are shipped with desiccants in heat-seale d moisture-proof bags. ` ? ` desic c ant s ? pr o d ucts sh ipp e d o n tape a n d r eel a r e p a ck ed in a moistu re-proo f bag. t h ey a r e shipp e d in card bo ard bo xes to p r otect th em fro m exte rnal f orce s during trans p o r ta tio n . ? \ H? y ? B ? ? y * ?` ? ? ? y ? ? * ? Q H n ? u? p ? ? ? ? * * u ? ?` ? n ? g o ?` y ? usin g a n orig inal packaging material or eq u i vale n t in t r an s i t is r e com m en de d. d o not ex po se to wa ter, the box is no t water-resi s t ant. do not drop o r sho c k the box. i t may dama g e th e pr o d ucts. m o is tu re -pr o of ba gs a r e pa ck e d in c a r d bo a r d bo x e s w i th c or r u ga ted pa rti t i on s . ? K ? ` ?
n i chia st s-da1- 2472a 8 l o t numbering scheme lot numb er is presented by using th e following alpha n u m er ic cod e . ymxxxx - r r r y - y e a r year y 2009 9 2010 a 2011 b 2012 c 2013 d 2014 e m - m o n t h month m month m 1 1 7 7 2 2 8 8 3 3 9 9 4 4 10 a 5 5 11 b 6 6 12 c xxxx -n ichia's product n u m b er r r r - r a n k * t h e l a b e l d oe s n o t h a v e the ra nk field for un -r ank e d products.
n i chia st s-da1- 2472a 9 dera ting characteristics n s s m 12 4x s t s -d a 7- 004 3b no . der a t i n g 1 0 50 10 0 15 0 20 0 25 0 0 2 0 4 06 08 0 1 0 0 1 2 0 ( 4 7, 88 . 7 ) b l u e ( 32, 12 4) g r ee n (3 8, 12 7)re d (85, 25.0)blue ( 85, 27.0 ) gree n ( 8 5, 30 . 0 ) r ed de r a t i n g 2 0 50 10 0 15 0 20 0 25 0 0 2 0 4 0 6 0 8 0 1 00 120 ( 4 0, 15 0) (85 , 37.5) duty 10 10 0 10 00 1 10 100 110 25 35 50 80 150 S allowable forward current ( ma ) ? - ?S ?p? am b i e n t te m p e r a t u r e v s t o t a l p o we r d i s s ip a t i o n ? ?- S p? a m b i en t t e m p e r a t u r e v s po w e r d i s s i p a t i o n S?p? pow e r d i s s i p at i o n ( m w ) ? S ?p? t o t a l p o w e r d i ssi p a t i o n ( m w ) ? ? a m b i en t t e m p er atu r e( c ) ?? a m b i en t t e m p er a t u r e ( c ) ? ` ` du t y r a t i o ( %) ` ` - S d u ty r a ti o v s a llo wa ble f o r w a r d c u r r e n t blu e g r een re d t a = 25 c blue green red * t h e gr a p h s h o w s t h e ma x i m u m a l l o w a bl e po w e r di s s i pa t i o n f o r a l e d di e o f e a c h c o l o r . ? ?H 1 ? ? * 2 ? ?H ? ` ? ? t h e gr a p h s h o w s t h e ma x i m u m a l l o w a bl e t o t a l po w e r di ss i p a t i o n fo r a l e d p a c k a g e . ** **
n i chia st s-da1- 2472a 10 optical characteristics ns s m 1 2 4 s t s -d a 7-00 44 no . y- y sp e c t r u m 0.0 0. 2 0. 4 0. 6 0. 8 1. 0 40 0 450 5 00 55 0 600 6 50 70 0 re l a t i v e l u m i n o s i ty ( a .u .) x- x rel a t i ve l u m i n o s i ty (a . u .) d ir e c t iv it y 2 90 80 70 60 50 40 30 20 10 0 -1 0 - 20 -3 0 -4 0 - 50 -6 0 -7 0 -8 0 -9 0 di rec t iv i t y 1 90 80 70 60 50 40 30 20 10 0 - 10 -2 0 -3 0 -4 0 -5 0 - 60 - 70 -8 0 -9 0 k r e la t i v e e m is s io n i n t e n s i t y ( a . u . ) k spe c t r um ? d i r e c t iv it y L wa ve l e n g th ( n m ) 10 . 5 00. 5 1 10 . 5 0 0 . 5 1 ? r a di a t i o n a n gl e ? ra d i a t i o n a n g l e t a = 25 c t a = 25 c t a = 25 c bl ue ( green ( re d ( i f = i f = i f = 20 m a ) 20 m a ) 20 m a ) bl u e ( gr e e n ( re d ( i fp = i fp = i fp = 20 ma ) 20 m a ) 20 m a ) bl u e ( gr e e n ( re d ( i fp = i fp = i fp = 20 m a ) 20 m a ) 20 m a ) * ?? a l l c h ar ac t e r i s t i c s s h o w n a r e f o r r e f e r e n c e o n l y a n d a r e n o t g u ar a n t eed . y(90) y(- 9 0 ) x (- 9 0 ) x (9 0 )
n i chia st s-da1- 2472a 11 for w a r d cur r e n t char acteris t ics / tempera t ure characteristics s t s -d a 7- 004 5a no . n s s m 12 4x tavf 1. 5 2. 0 2. 5 3. 0 3. 5 4. 0 4. 5 5. 0 - 6 0 - 4 0 - 2 0 0 20 40 60 80 1 00 120 taiv 0. 6 0. 8 1. 0 1. 2 1. 4 - 60 - 4 0 - 2 0 0 2 0 40 6 0 80 1 0 0 1 20 vf i f 1 10 100 1 000 1. 5 2. 0 2. 5 3 . 0 3 . 5 4 . 0 4. 5 5. 0 80 11 0 15 0 20 relative luminosity(a.u.) ??- am b i e n t te m p e r a t u r e v s r e l a ti v e l u m i n o s i ty for ward curren t( m a) ifiv 0 1 2 3 4 5 6 7 0 5 0 1 00 150 2 00 r e la t i v e l u m i n o s i t y ( a .u .) - fo r w a r d c u r r e n t v s r e l a ti v e lu m i n o s i ty f o r w a r d c u rre nt ( m a ) R- fo r w a r d v o l t a g e v s fo r w a r d c u r r e n t ? - R amb i e n t t e mp e r a t u r e v s fo r w a r d v o l t a g e ?R for w a r d v o lt a g e( v ) R f orward voltage(v) ?? ambi e n t t e m p erature ( c ) ?? a m bien t t e m p er a t u r e( c ) green 20m a 20m a i fp = i fp = bl u e re d 20m a i fp = bl ue gr e e n red bl u e gr e e n red t a =2 5 c * ?? a l l c h ar ac t e r i s t i c s s h o w n a r e f o r r e f e r e n c e o n l y a n d a r e n o t g u ar a n t eed . t a =25 c gr e e n 20ma 20m a i fp = i fp = bl u e red 20m a i fp =
n i chia st s-da1- 2472a 12 reliability (1) t e s t s a n d r e sults te s t reference standard test conditions te s t duration failure criteria # units failed/tested r e si st anc e t o soldering heat (reflow soldering) j e it a ed- 4701 300 30 1 t sl d =260c, 10 s e c, 2refl ows , prec ondit i o n : 3 0 c, 70% r h , 168hr #1 0/ 50 temperature cycle j e it a ed- 4701 100 10 5 - 40c( 30mi n )~25c( 5mi n )~ 100c( 30m i n )~25c( 5mi n ) 100c y c l e s #1 0/ 50 moisture resistance (cyclic) j e it a ed- 4701 200 20 3 25c~65c~-10c, 90% r h , 24hr per cy cle 10c y c l e s #1 0/ 50 high temperature stor age j e it a ed- 4701 200 20 1 t a =100c 500hours #1 0/ 50 temperature humidity stor age j e it a ed- 4701 100 10 3 t a =60c, r h =90% 500hours #1 0/ 50 low temperature stor age j e it a ed- 4701 200 20 2 t a =- 40c 500hours #1 0/ 50 room temperature operating life t a =25c b i f =9ma g i f =14m a r i f =18m a 500hours #1 0/ 50 temperature humidity operating life 60c, r h =90 % b i f =5ma g i f =11m a r i f =11m a 500hours #1 0/ 50 low temperature operating life t a =- 30c b i f =9ma g i f =14m a r i f =18m a 500hours #1 0/ 50 no tes: measuremen ts ar e perf ormed after allowi ng t h e l e d s to re turn to room te mp er at ure. ( 2 ) f a ilu re c r it eria ( v al u e f o r on e le d dev i ce (sin gle colo r ) . ) criteria # items conditions failure criteria f o rw ard v o ltag e(v f ) b i f =20m a g i f =20m a r i f =20m a >u.s.l.1.1 lumino us in te nsi t y ( i v ) b i f =20m a g i f =20m a r i f =20m a u .s .l .2 . 0 u . s.l . : up pe r specif ica t ion lim i t l.s.l. : lower spe c if ica t io n li mi t
n i chia st s-da1- 2472a 13 ca u t ion s (1) stor age conditions temperature humidity time before opening aluminum bag 30c 90%rh within 1 year from delivery date stor age after opening aluminum bag 30c 70%rh 168hours baking 655c - 24hours product c o m p li es wit h j e d e c msl 3 or equiv a lent . se e ipc/j e d e c std - 020 for m o i s t u re- s ens i t i v i t y det a il s. absorbed moisture in le d packages can v aporize and expand during soldering, w h ich can ca use in te rface de lam i na tion and result in optical p e rforman c e degr ad ation . prod ucts are pack e d in moisture-proof alu m inu m bag s to min i mize moistur e abso r ptio n d u ring tr ansporta tion a n d stor age. in c l u d e d s ilic a ge l de si cc ant s ch an ge from bl u e t o re d i f m ois tu re h ad pe n e t r at e d bags. after openin g the moisture-proof alu m inu m bag, the pro d ucts should g o through th e solder ing pro c ess withi n th e r a nge of th e co ndi t ion s s t at ed above. un us e d rema in ing le ds shou ld be s t ored wi th silic a gel de sicca nt s in a hermetically sea l ed co nta i ner , prefer ably th e orig in al mo isture -pr oof bags for stor age. after t h e ?p eriod aft e r op eni n g? s t or age time h a s be en exceed ed or s i l i ca ge l de sicca nts ar e no lo ng er blu e , the products should be b a k ed. baking should only be d one once. the lead s or electrod e pad s (anod e and cathode) of th e product ar e pla t ed w i th silv er . exposure to a corrosiv e en vir onment might caus e the silver pla t ed th e l e ads or ele c trod e pad s to tarn i s h, a n d thu s l e adi ng to diffi cu lt ie s i n sold eri n g. if unused l e ds rema in , t h ey mu st b e sto r ed in a h e rme t i c al ly s e al ed c ontai ner . n i ch ia reco mmend s using the or iginal moisture-proof bag for stor age. do not use s u lfur- c on tai n i n g ma teri als i n commercial products. some mater i als, su ch a s seals and adh esives, ma y co nta i n su lfur . the extre m ely corroded or conta m inat ed plating of le ds mig h t cause a n open ci rcuit. si li co ne rubb er i s recomm end e d as a mater i al for sea l s. bear in mi nd , t h e use of s i l i co ne s may l e ad to si li co ne con t a m i n at ion of e l e c tri c a l con t ac ts inside th e p r oduct s , caus e d by lo w mol e c u lar we igh t vol a ti le si loxane . t o prevent w a ter cond en s a tion , p l eas e avoid large te m p er at ure a n d h u midi t y fl uc tua t ions for th e s t or age condi t io ns. (2) di recti o ns for use in des i gn ing a circ uit, the c u rren t throu g h each l ed d i e mu st no t exc e ed th e abso lu t e maxi mu m r a tin g curre nt specifi e d for each d i e . it is reco mmen ded that each le d di e is d r i v e n at a c ons t a nt cu rre nt . when hav i n g the two or m ore dic e wi th in thi s produ c t o n at t h e sa m e ti me , t h e to tal power dissipation for the le d package must be w i t h in th e abso l ut e max i m u m v a lue spe c if ied in thi s sp ecif i c at i on. leds sho u ld be oper ated in forw ard bias. driv ing c i rc uits mus t no t subj ect le ds to ei t h er forw ard or reverse vol t ag e whi l e off . continuo us reverse vol t ag e can cause migr ation an d le d damage. f or s t abi l i z in g t h e led c h ar ac t e r i st ic s, it is re c o m m end e d to oper ate a t greater than 1 0 % nom i na l cu rrent . care mu st b e taken to en s u re th at t h e re verse vol t age wil l no t exce ed the ab sol u t e maxi mu m r a t i ng when us ing the l ed s wi th matr ix drive . f or outdoor use , ne ce ssary mea s ure s sho u ld be taken to prevent wa ter , moi s tur e and sal t air da mag e . (3) handl i n g precau ti ons do not hand le le ds wi th b a re hand s, it ma y con t a m i n ate the l e d su rface and affect opt i ca l char a c ter i s t i c s . in the worst case , ca tas t ro phic fa il ure fro m exce ss pr es sure throug h w i re-bond break s and packag e damage ma y r e su lt. when ha ndling the produ c t with tweez e r s , be ca refu l n ot to apply ex cessiv e force to the r e sin. otherwis e, the re si n can be cu t, ch ipped, delamina te or deform ed , causing w i re-bo n d breaks an d cata stroph ic fa ilures. d r opping th e prod uct ma y cause damage. do not sta c k asse mb led p c bs tog e t h er . f a ilure to comp l y can cau s e th e res i n port io n of the produ c t to be cut, ch ip ped, delaminated and/or defor m ed . it ma y cause w i re to break, lead ing to catastroph ic f a ilures.
n i chia st s-da1- 2472a 14 (4) desi gn consi d er ati o n pcb w a rpag e after moun ting th e products on to a pc b c a n cau s e the p a ckage to br ea k. the led sh ould be p l aced in a w a y to minimize t h e s t re ss on the l e ds due to pc b bo w and tw is t. the positi o n and ori e nta t i o n of the leds affect how much m e cha n i c al stre ss i s exerte d on the le ds placed near th e score lin e s. the led sh ould be p l aced in a w a y to minimi ze the stress on the l e ds due to board f l ex ing. board separation mu st b e performed usin g spec ia l j i g s , not u s in g hand s. (5) el ectrostati c di scha r ge (es d ) the produ c t s are se ns it ive to sta t ic e l e c tr i c i t y or su rg e v oltag e. es d ca n damag e a die and its reliab ilit y . when handl i ng t h e produ c ts , th e fol l owi n g mea s ure s ag ainst electro s tatic disch arge are strongl y recomm ended : e l i m i n a t i n g t h e c h a r g e g r ou n d e d w r i s t s t r a p , e s d footw e ar , clothes, a n d floo rs grounded workstat ion equi pmen t and tools esd table/shelf ma t ma de of condu c tive ma ter i als pr oper gr ou nding is r e qu ir ed f or all d e vi c e s, eq u i pmen t, and machiner y used in prod uct a s semb ly . surge protection s h oul d be cons idere d wh en de si gn in g o f c om m e r ci al p r od u c ts . if tools or e q uip m e n t co nt ain i n s u la ting mat e ria l s su ch as gla ss or pla s t i c , t h e fol l owi ng m e as u r es agai n s t el ec t r os tatic disch arge are st rongl y recomm ended : diss ipat i n g sta t ic c h arg e with co nduc t i ve mat e ria l s preventi ng charg e gen e r a tion w i th m ois ture n e u t r a l i z i n g t h e c h a r g e w i t h i on i z e r s the c u s t om er is adv is ed t o che c k if the leds are da ma ged by esd when performing th e char acteri stics in spection of the led s in the app lication. d a mage ca n be detected with a forw ard v oltage mea s u r ement or a li gh t - u p t e s t at l o w c u r r e nt ( 1m a ) . l e d s w i t h es d - da m a ge d di c e ( i . e . o t h e r th a n r e d) m a y h a v e an increa sed leakage cu rrent, curr ent f l ow at a low v oltag e, or no longer il lu mi nat e at a low cur r e nt. f a ilur e c r iter ia : v f <2.0 v at i f =0.5ma (6) t h ermal manageme nt proper th er mal manag e m e nt is a n i m po r t an t when designing prod uc ts with le ds . le d di e t e mp er ature i s affec t ed by pcb ther mal r e sistan ce and le d spa c ing on th e board. pleas e de sig n produc ts in a w a y that t h e l e d d i e t e mperature does not exceed th e max i mu m j unc t i on t e mper a t ure ( t j ). drive curre nt s h oul d be d e ter m ined for t h e s u rround ing ambi en t te mp er ature (t a ) to dis s ipa t e the h e at from the pr oduct . (7) cl eani ng if r e quir ed, isopr opyl a l coh ol (ip a ) s h oul d be use d . ot he r solven ts may caus e pre m at ure fai l ure to t h e le ds due to the d a mage to th e r e si n port ion . t h e effe ct s of s u ch solve n t s s h ould b e ver i f i ed pr ior to u s e . in additio n , the use of c f c s su ch as freon is hea v ily regula ted . ul tr ason ic cl eani ng i s no t recommende d s i nc e i t ma y have adverse eff e ct s on t h e l e ds depending on the ultr ason ic power an d h ow led is assembled. if ultr asoni c clea ni ng mus t be use d , t h e c u sto m er is adv ise d to mak e sure th e le d s w i ll not b e da ma ged prior to cleaning . (8) ey e saf e t y in 2006, t h e interna t i o nal el ec t r i c a l comm is si on (iec ) publi s hed iec 62471: 200 6 phot obi o l ogic a l s a fet y of l a m p s and lamp sy ste m s, wh ic h a dded le ds in its scop e . on t h e ot her hand, t h e iec 60825- 1: 20 07 l a s e r s a f e t y s t andard r e mo v e d leds from it s sc ope. howev e r , please b e advised that some co untr i es and regions ha v e ado pted stand a rds bas ed on t h e iec l a s e r safet y s t a n dard iec 60825- 1: 20 112001, whi c h s t ill i n cl udes leds i n i t s sc op e. most of n i chi a 's leds ca n be cl a s si fied as bel o ng ing in to either the ex empt group or risk group 1. high-power leds, tha t e m it ligh t con t aining blu e w a vel e ngth s, ma y be cla s sified as risk group 2. please pro c eed wi th cau t io n whe n view in g direc t ly an y leds driv en at high current, o r vi ewing led s with opt i ca l ins t ru me nt s w h ic h may gr eat l y in crea se t h e damage s to your eyes . view ing a f l ashing ligh t ma y cause ey e d i scomfort. when incorpor ating the l e d into y our product, please be careful to a v oid adv erse eff e cts on the hu man body caused by ligh t stimu l a t ion.
n i chia st s-da1- 2472a 15 (9) ot hers the le ds d e scr ibed in th is brochure ar e i n te nded to be used for ordina ry el ectroni c equi p m ent ( s uch as offi ce eq uipm ent, commun i cat i ons equ i pm en t, meas ure m e n t in str u m e n t s and hou s eho l d applia nc es ). consult nichia's sales staf f in adv an ce fo r informa t io n on th e applica t ions in wh ich ex ceptiona l qua l it y and r e liab i l i t y ar e r e q u ir ed , par t i cu lar l y when the f a ilur e or malf u n c t ion of the le ds m a y dir e c t ly j e o par dize lif e or h e a l t h ( s u c h a s f or a i r p la ne s , ae r os p ac e, s u bm e r si bl e repeaters, nuc l e ar reactor co ntrol system , a u tom obil e s, tr affic contr ol equ i p m en t, l i fe s u pport sy s t e m s and safe ty devic e s ) . the c u s t om er sha ll not reverse eng i ne er by disas s e m bl i n g or analys i s of the le ds wi t h out ha v i ng pr i or writt e n co ns ent from nich ia . when def e c t ive le ds are fou n d, t h e c u s t om er sha ll inf or m ni ch ia dir e c t ly bef or e di sas s e m bl ing or ana l ysis . both th e cu sto m ers a n d ni chia w i ll agr ee on offici al s p ec ifi c at io ns of su pplied produc ts before a custom er 's v olume production . specificatio ns and app ear a nce subject to chang e for i m provem en t w i tho u t not i c e .


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